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SOURCE Toshiba America Electronic Components, Inc.
IRVINE, Calif., Feb. 25, 2014 /PRNewswire/ -- Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, knows that when it comes to storage architecture, enterprises require a different set of features than consumers – namely higher performance, improved endurance and power efficiency. For datacenter applications – including cloud computing, caching, datacenters, and database applications - data accessibility and speed are the name of the game.
In a recently released video, the third in a series titled "Memory Design Insights" that takes viewers inside memory design issues with straight talk from Toshiba's memory experts, Doug Wong, senior member of TAEC's technical staff, details the advantages that NAND flash brings to the datacenter. These advantages include more write/erase cycles compared to conventional MLC NAND and shorter read latency, higher performance, reduced footprints and lowered storage management and administration costs when compared to HDD (hard disk drive)-based systems.
Designed for the intense, constantly evolving demands of the enterprise, Toshiba's two families of enterprise NAND are eSLC (from 64 Gb-256 Gb) and eMLC (from 128 Gb-512 Gb). When compared to standard consumer MLC devices, these enterprise NAND offerings bring extended endurance (extended write/erase cycles), and longer product life. Both families use a Toggle Mode NAND flash interface, which employs a double data rate transfer.
According to Wong, "Five years ago, 'Enterprise NAND' did not exist. Realizing that these data-hungry applications would eventually need high-performing storage solutions that also provided extended endurance, we created a line of NAND solutions with these needs in mind. Today, the benefits of enterprise NAND can be clearly seen – including high speed data streaming and internet access. Toshiba will continue to anticipate future needs when developing our NAND solutions – to enable a better connected world."
To view the full video on NAND for the enterprise click here. For more information on memory products from Toshiba, please visit http://www.toshiba.com/taec/adinfo/technologymoves or http://www.toshiba.com/taec/index.jsp.
*About Toshiba Corp. and TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
For additional company and product information, please visit http://www.toshiba.com/taec/.
 Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. Maximum read and write speed may vary depending on the host device, read and write conditions, and file size.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.
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